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Reliability Technology for Integrated Circuit Packaging.
- Format:
- Book
- Author/Creator:
- Zhou, Bin.
- Series:
- Engineering Series
- Language:
- English
- Physical Description:
- 1 online resource (532 pages)
- Edition:
- 1st ed.
- Place of Publication:
- Singapore : Springer, 2026.
- Summary:
- This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 981-9538-85-8
- OCLC:
- 1587598425
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