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Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration.
- Format:
- Book
- Author/Creator:
- Lau, John.
- Series:
- Engineering Series
- Language:
- English
- Physical Description:
- 1 online resource (637 pages)
- Edition:
- 1st ed.
- Place of Publication:
- Singapore : Springer, 2026.
- Summary:
- This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration.Both principles and engineering practice have been addressed, with more emphasis placed on engineering practice.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 9789819568918
- OCLC:
- 1601989195
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