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2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) : conference proceedings : 21st- 24th of October 2020, Pitesti, Romania / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Electronic apparatus and appliances--Congresses.
- Electronic apparatus and appliances.
- Electronic packaging--Congresses.
- Electronic packaging.
- Physical Description:
- 1 online resource
- Other Title:
- 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging
- Place of Publication:
- IEEE 2020-12-28
- Piscataway, New Jersey : IEEE, 2020.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 9781728175065
- 1728175062
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