Introduction to flexible electronics / Aftab M. Hussain.

Format:

Book

Author/Creator:

Hussain, Aftab M., author.

Language:

English

Subjects (All):

Flexible electronics.

Technological innovations.

Physical Description:

1 online resource (314 pages)

Edition:

First edition.

Place of Publication:

Boca Raton, FL : CRC Press, 2022

Summary:

"The field of flexible electronics has grown rapidly in the last two decades, with diverse applications including wearable gadgets and medical equipment. This textbook comprehensively covers fundamental aspects of flexible electronics along with materials and processing techniques. It discusses topics including flexural rigidity, flexible PCBs, organic semiconductors, nanostructured materials, material reliability, electronic reliability, crystalline and polymer materials, semiconductor processing and flexible silicon in depth. The text covers advantages, disadvantages, and applications of processes such as sol-gel processing and ink-jet printing. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understanding. The textbook is primarily written for senior undergraduate and graduate students in the field of electrical engineering, electronics, and communication engineering for a course on flexible electronics. The textbook will be accompanied by teaching resource including solution manual for the instructors"-- Provided by publisher.

Contents:

Cover

Half Title

Title Page

Copyright Page

Contents

Preface

Author

PART I: Introduction

Chapter 1: Introduction

1.1. The Semiconductor Revolution

1.2. History of Flexible Electronics

1.3. Need for Flexible Electronics

1.4. Example Applications

Chapter 2: Physics of Flexible Electronics

2.1. Why Are Things Flexible?

2.2. Bending Radius and Curvature

2.3. Plate Flexure

2.3.1. Flexure

2.3.2. Buckling

2.4. The Ball-Spring Model

2.5. Flexibility in Polymers

Exercises

Chapter 3: Semiconductor Basics

3.1. The Silicon Atom

3.2. The Silicon Lattice

3.3. Doping Silicon

3.4. Semiconductor Fabrication Techniques

3.4.1. The Silicon Wafer

3.4.2. Deposition

3.4.3. Lithography

3.4.4. Etching

3.5. Silicon Transistors

3.5.1. Thin-Film Transistors

PART II: Materials

Chapter 4: Flexible Silicon

4.1. The Story of Silicon

4.2. Silicon Substrates

4.2.1. Crystallography

4.2.2. Charge Transport

4.2.3. Semiconductor/Oxide Interface

4.3. Flexible Monocrystalline Silicon

4.3.1. Device-Last Approach

4.3.2. Device-First Approach

4.3.2.1. Top-Down Method

4.3.2.2. Bottom-Up Method

4.4. Silicon TFTs

Chapter 5: Organic Electronic Materials

5.1. Introduction

5.2. Conduction in Organic Molecules

5.3. Properties of Organic Conduction

5.3.1. Carrier Mobility

5.3.2. Electron-Hole Stability

5.3.3. Polaron Transport

5.4. Organic Small Molecules

5.5. Organic Polymers

5.5.1. Copolymers

5.6. Organic Thin Film Deposition

5.7. Organic Single-Crystals

5.8. Organic Field-Effect Transistors (OFETs)

Chapter 6: Metal Oxide Semiconductors

6.1. Introduction

6.2. Metal Oxide Semiconductor Properties

6.3. Ternary and Quaternary Metal Oxides

6.4. Deposition Techniques.

6.4.1. Vacuum Deposition

6.4.2. Solution Processing

6.5. Metal Oxide TFTs

6.5.1. Wavy Channel TFTs

Chapter 7: III-V Semiconductors

7.1. Introduction

7.2. Properties

7.3. III-V Wafers

7.3.1. Epitaxy

7.4. Flexible III-V Semiconductors

7.5. III-V Thin Films

Chapter 8: Nanostructured Materials

8.1. Introduction

8.2. Two-Dimensional Materials

8.2.1. Graphene

8.2.2. Transition Metal Dichalcogenides (TMDs)

8.2.3. Hexagonal Boron Nitride (H-BN)

8.2.4. Other 2D Materials

8.3. One-Dimensional Materials

8.3.1. Carbon Nanotubes (CNTs)

8.3.2. Metal Nanowires

8.3.3. Semiconducting Nanowires

8.3.4. Other 1D Materials

8.4. Zero-Dimensional Materials

8.4.1. Metal Nanoparticles

8.4.2. Semiconducting Nanoparticles

PART III: Integration Strategies

Chapter 9: Substrates, Transfer, and Bonding

9.1. Introduction

9.2. Flexible Substrates

9.2.1. Metal Foil Substrates

9.2.2. Flexible Glass Substrates

9.2.3. Polymer Substrates

9.3. Transfer Printing

9.3.1. Viscoelastic Stamp

9.3.2. Thermal Release Stamp

9.3.3. Solvent Release Stamp

9.4. Adhesive Bonding

Chapter 10: Barriers, Insulators, and Packaging

10.1. Introduction

10.2. Barrier Thin Films

10.2.1. Permeation Mechanisms

10.2.2. Barrier Materials

10.3. Flexible Dielectrics

10.3.1. Inorganic Dielectrics

10.3.2. Organic Dielectrics

10.3.3. Hybrid Dielectrics

10.4. Packaging Strategies

Chapter 11: Flexible Printed Circuit Boards

11.1. Introduction

11.2. Flexible PCB Design

11.2.1. Flexible PCB Materials

11.2.2. Flexible PCB Fabrication Process

11.3. Flexible Hybrid Electronic (FHE) Systems

11.3.1. Small Silicon Chips

11.3.2. Rigid-Flex Integration

11.4. Fully Flexible Systems

Exercises.

Chapter 12: Printed Electronics

12.1. Introduction

12.2. Ink Formulation

12.3. Inkjet Printing

12.3.1. Jet Formation

12.4. Other 2D Printing Techniques

12.5. Three-dimensional (3D) Printed Electronics

12.6. Nanoimprint Lithography

12.6.1. Self-Aligned Imprint Lithography (SAIL)

PART IV: Applications

Chapter 13: Flexible Processors

13.1. Introduction

13.2. Conventional Electronics

13.2.1. Dimensional Scaling

13.2.2. CMOS Technology

13.3. Flexible Transistors

13.3.1. Organic Semiconductors

13.3.2. Metal Oxide Semiconductors

13.3.3. Nanostructured Semiconductors

13.4. Flexible Circuits

Chapter 14: Flexible Memory

14.1. Introduction

14.2. Volatile Memory

14.2.1. Conventional Volatile Memory

14.2.2. Flexible Volatile Memory

14.3. Non-Volatile Memory

14.3.1. Conventional Non-Volatile Memory

14.3.2. Flexible Non-Volatile Memory

14.3.2.1. Flexible ReRAM

14.3.2.2. Flexible FeRAM

14.3.2.3. Flexible PCRAM

14.3.2.4. Flexible Flash Memory

Chapter 15: Flexible Displays

15.1. Introduction

15.2. Conventional Displays

15.3. Flexible Displays

15.3.1. Organic LEDs

15.3.2. Flexible AMOLED Displays

15.3.3. Other Flexible Display Technologies

Chapter 16: Flexible Energy Generation and Storage Devices

16.1. Introduction

16.2. Energy Generation

16.2.1. Photovoltaic Devices

16.2.1.1. Flexible Inorganic Photovoltaics

16.2.1.2. Flexible Organic Photovoltaics

16.2.2. Energy Harvesting Devices

16.3. Energy Storage

16.3.1. Flexible Batteries

16.3.2. Flexible Supercapacitors

Chapter 17: Flexible Sensors and Actuators

17.1. Introduction

17.2. Flexible Sensors

17.2.1. Temperature Sensors

17.2.2. Strain Sensors

17.2.3. Pressure Sensors

17.2.4. Other Sensors.

17.3. Flexible Actuators

17.3.1. Microelectromechanical Systems (MEMs)

17.3.2. Electroactive Polymers (EAPs)

17.3.2.1. Dielectric Elastomer Actuators (DEAs)

17.3.3. Piezoelectric Actuators

17.3.4. Shape Memory Alloys

PART V: The Road Ahead

Chapter 18: Stretchable Electronics

18.1. Why Stretchable?

18.2. Imparting Stretchability

18.2.1. Stretchability by Material

18.2.2. Stretchability by Design

18.3. Stretchable Conductors

18.3.1. Polymer Composites

18.3.2. Metal Springs

18.3.3. Liquid Metals

18.4. Some Stretchable Electronics Applications

Chapter 19: Reliability and Future Outlook

19.1. Introduction

19.2. Reliability in Flexible Electronics

19.3. Future Outlook

References

Index.

Notes:

Includes bibliographical references and index.

Description based on print version record.

ISBN:

1-00-301071-7

1-000-48618-4

1-000-48619-2

1-003-01071-7

9781003010715

OCLC:

1283845138