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Chemical vapor deposition (CVD) : Methods and technologies. / edited by Levi Karlsson.
- Format:
- Book
- Series:
- Chemical Engineering Methods and Technology
- Language:
- English
- Subjects (All):
- Chemical vapor deposition.
- Physical Description:
- 1 online resource (222 pages)
- Place of Publication:
- New York, New York : Nova Science Publishers, Incorporated, [2021]
- Summary:
- "Chemical vapor deposition (CVD) refers to a vacuum deposition method used to produce high quality, high-performance, solid materials in a variety of manufacturing industries. Chapter One provides a critical review of published experimental data for thin films of silicon nitride deposited by thermal and plasma CVD, plasma CVD, high density plasma CVD, atomic layer-by-layer deposition, and hot-wire CVD. Chapter Two describes several aspects of the use of CVD for single-crystal diamond synthesis for electronics. Chapter Three describes the properties of graphene and its preparation by a number of methods with a focus on the classical CVD method on copper foil together with graphene transfer onto a dielectric substrate"-- Provided by publisher.
- Contents:
- Intro
- Contents
- Preface
- Chapter 1
- CVD Technologies and Basic Properties of SiNH-Contained Thin Films for Applications in Electronic Devices
- Abstract
- 1. Introduction
- 2. Thermally-Activated CVD in Flow-Type Reactors
- 2.1. Brief Description of Thin Film CVD Processes
- 2.2. Industrial Technologies for Production of S-SNTF by CVD
- 2.3. Directions for Improvement of the Technologies of SNTF by CVD
- 2.3.1. Improvement of the Existing Industrial Processes for S-SNTF in LPCVD Reactors
- 2.3.2. Modernization of the Processes for Obtaining Films in Flow CVD Reactors
- 2.3.3. New Reactants for Production of S-SNTF in Flow CVD Reactors
- 2.3.4. Single Substrate Flow Reactors for Production of S-SNTF by CVD
- 2.4. Conclusion to Section 2
- 3. Thermally-Activated CVD in Cycle-Type Reactors
- 3.1. Brief General Description of Thin Film Cycle-Type Processes
- 3.2. Cyclic Deposition with the Use of the Traditional Industrial Reagents
- 3.3. Cyclic Deposition with the Use of New Reagents
- 3.4. Conclusion to Section 3
- 4. Plasma-Actiivated Processes in Flow-Type Reactors
- 4.1. Brief Description of Thin Film Plasma-Activated Processes
- 4.2. Previous Summaries of Publications Concerning PECVD SiNH-TF
- 4.3. Industrial Technologies for the Production of SiNH-TF by PECVD
- 4.4. Directions for Improvement of the Technologies of SiNH-TF by PECVD
- 4.5. Conclusion to Section 4
- 5. Processes in Flow-Type Reactors with High Density Plasma
- 5.1. Brief Description of Thin Film High Density Plasma Activated Processes
- 5.2. HDP-CVD SNTF: Basic Results
- 5.3. HDP-SNTF Deposition in Experimental Reactors
- 5.4. Conformality and Directions of HDP-SNTF Deposition Improvement
- 5.5. Conclusion to Section 5
- 6. Plasma-Activated Processes in Cycle-Type Reactors.
- 6.1. Brief Description of Plasma-Activated TF Deposition in Cycle-Type Processes
- 6.2. Brief Review of the Basic Types of the Reactors for PE-ALD
- 6.3. Thin Film Deposition with the Use of the Inorganic Precursors
- 6.3.1. PE-ALD from Silanes
- 6.3.2. PE-ALD from Amines
- 6.3.3. PE-ALD from Chlorosilanes
- 6.4. Thin Film Deposition with the Use of the
- Organic Precursors
- 6.5. Comparison of ALD Processes with the Other SNTF Deposition Processes
- 6.5.1. TA-ALD vs. PE-ALD Films
- 6.5.2. PECVD vs. PE-ALD
- 6.6. Conclusion to Section 6
- 7. Hot-Wire CVD in Flow-Type Processes
- 7.1. Brief Description of Hot-Wire CVD Processes
- 7.2. Brief Review on HW-CVD Processes and SiNH-TF Properties
- 7.3. Brief Review on HW-CVD SiNH-TF Reaction Mechanism
- 7.4. Comparison of HW-CVD and PECVD Processes for SiNH-TF
- 7.5. Directions for HW-CVD Processes Development
- 7.6. Conclusion to Section 7
- 8. SNTF Composition and Properties
- 8.1. Relationships between CVD Process Parameters and Thin Film Quality
- 8.2. Temperature Dependences of SNTF Deposition Rates
- 8.3. Temperature Dependencies of SNTF Composition
- 8.4. Basic Physical and Chemical Properties of SNTF
- 8.5. Basic Physical and Chemical Properties of SNTF
- 8.6. Conclusion to Section 8
- Conclusion
- References
- Biographical Sketches
- Chapter 2
- Rapid-Heating Criterion in CVD Diamond Growth Technology and Possibility of Synthesizing Large Diamonds without High Pressure and Prepared Substrate
- Introduction
- 1. General Physical Picture
- 2. Elementary Processes of Gas-Phase Clusters of Diamond and Graphite and Their Description Technique
- 2.1. Number of Surface Atoms in Diamond- and Graphite Clusters and Surface Energy of These Clusters
- 2.2. Model of Gibbs Free Energy Change in the Course of Nucleation and Growth of Cluster.
- 2.3. Comparative Surface Energies of Diamond- and Graphite Clusters
- 2.4. Desorption of Small Hydrocarbon Species from Surface of Diamond- and Graphene Clusters and Their Formation from Initial Gas Mixture
- 2.5. Oxidation of Diamond- and of Graphene Clusters
- 2.6. Desorption Dynamics Delay of Small Hydrocarbon Species as Compared with Temperature Growth
- 2.7. Estimation of Nucleation Onset Moment at Supersaturation Decay of Small Hydrocarbon Species
- 3. Nucleation and Growth of Diamond Clusters in Carbonate-Silicate Matrix
- 3.1. Simulation of How Growing Graphite- or Diamond Clusters Interact with Melt. Selection of Melt
- 3.2. Conditions for Saturation and Supersaturation of Melt Cells with Carbon Carrier
- 3.3. Diamond Cluster Nucleation Problem for Carbonate- Silicate Melt
- Supplements
- Competition Financial Interests
- Chapter 3
- Graphene Preparation by Chemical Vapour Deposition Method and Its Basic Parameters
- 2. Properties of GR
- 3. Methods of GR Preparation
- 4. CVD Preparation of GR
- 5. Transfer-Free CVD Process
- 6. Surface Treatment of Cu Foil Before CVD Growth of GR
- 7. Parameters of GR Growth by CVD on Copper
- 8. GR Prepared by CVD Method on Silicon Carbide
- Biographical Sketch
- Index
- Blank Page
- Blank Page.
- Notes:
- Description based on print version record.
- Includes bibliographical references and index.
- ISBN:
- 1-5361-9990-7
- OCLC:
- 1263028790
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