1 option
Book of Abstracts from the 5th Passive Components Networking Symposium (PCNS).
- Format:
- Book
- Author/Creator:
- Zednicek, Tomas.
- Language:
- English
- Subjects (All):
- Passive components.
- Electrical engineering.
- Physical Description:
- 1 online resource (47 pages)
- Edition:
- 1st ed.
- Place of Publication:
- Zurich : Trans Tech Publications, Limited, 2025.
- Summary:
- Book of Abstracts from the 5th Passive Components Networking Symposium (PCNS).
- Contents:
- Book of Abstracts from the 5th Passive Components Networking Symposium (PCNS)
- Foreword
- Table of Contents
- Session 1: Harsh Applications
- Quality Challenges and Risk Mitigation for Passive Components in Harsh Environments
- Thermoset Polymer Dielectric Capacitors for Harsh Environment Applications
- Tantalum Capacitor Technology Advantages for Harsh Environments: A Technical Overview Based on Vishay’s Innovations
- Silicon Capacitors: Reliable Performance in Extreme Conditions
- Session 2: Quality & Reliability
- Advances in the Environmental Performance of Polymer Capacitors
- Enhancing E-Textile Reliability: A Comparative Study of SMD-Ribbon Joints Protections against Sweat
- New Generation of Metallized Film Capacitors Based on EPN for Solving Upcoming High Temperature and High-Power Density Requirements
- Protecting the Quality & Reliability of Passive and Active Components: The J-STD- 075 PSL Classification & Labeling
- Lifetime Assessment for Capacitors in EPS Application
- Development and Validation of IRCA S.P.A.’s Pure-Polyimide Flexible Heater for High-Reliability and High-Performance Markets
- Life Cycle Assessment of a Graphene-Based Supercapacitor: Environmental Hotspots and End-of-Life Strategies for Sustainable Energy Storage
- Capacitor Degradation and Failure Mechanisms: Exploring Different Causes across Technologies
- Beyond 85/85: Towards Realistic Lifetime Estimation of Polypropylene Film Capacitors in Humid Environments
- Special Session: AI and its Consequences
- Computer Vision-Driven Verification of Passive Component Assembly on Space-Grade PCBs
- Passive Components in AI Systems
- AI Hardware Development and its Consequences for Passive Electronic Components
- Session 3: New Development
- Space Evaluation Testing on SAW Filter Based on POI Technology
- Textile-Based Antennas for Wearable Applications
- New Construction and Packaging Process for Highest Voltage Aluminium Polymer Electrolytic Capacitor
- A New Approach to the Design of High Precision Integrated Resistive Voltage Dividers
- High-Frequency Capacitor Performance of Novel Embedded Electrode Design
- Session 4: Materials & Processes
- Flaked Tantalum Powders: High Capacitance Powders for High Reliable Tantalum Capacitors Generated by AI.
- Notes:
- Description based on publisher supplied metadata and other sources.
- Part of the metadata in this record was created by AI, based on the text of the resource.
- ISBN:
- 3-0364-1782-6
- OCLC:
- 1534197679
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.