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Instant Bonding Epoxy Technology.
- Format:
- Book
- Author/Creator:
- Chen, Shourong.
- Language:
- English
- Physical Description:
- 1 online resource (214 pages)
- Edition:
- 1st ed.
- Place of Publication:
- Singapore : Bentham Science Publishers, 2025.
- Summary:
- Instant Bonding Epoxy Technology is a comprehensive guide on the chemistry, formulation, and applications of epoxy adhesive technology, focusing on instant bonding innovations. Authored by a leading expert in polymer science, the book explores the latest advancements across UV, thermal, hybrid, and ambient curing technologies.Structured into six chapters, it begins with the fundamentals of epoxy resins, curing agents, and adhesive formulations. Subsequent chapters cover UV cure cationic epoxy chemistry, dual cure hybrid systems combining UV and thermal processes, and snap thermal cure adhesives leveraging latent curing agents. Advanced topics include induction cure epoxy technology with laser and weld bonding applications, as well as snap ambient cure systems for room-temperature bonding. Readership:Ideal for researchers, formulating chemists, and engineers in academia and industry.
- Contents:
- Intro
- Title
- Copyright
- End User License Agreement
- Contents
- Foreword
- Preface
- Introduction
- UV Cure Cationic Epoxy Technology
- Dual Cure Hybrid Epoxy Technology
- Snap Thermal Cure Epoxy Technology
- Induction Cure Epoxy Technology
- Snap Ambient Cure Epoxy Technology
- Subject Index.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 9789815313444
- 9815313444
- OCLC:
- 1516362383
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