1 option
Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
- Format:
- Book
- Author/Creator:
- Lindenmann, Nicole
- Series:
- Karlsruhe Series in Photonics and Communications / Karlsruhe Institute of Technology, Institute of Photonics and Quantum Electronics (IPQ)
- Language:
- English
- Physical Description:
- 1 online resource (XXI, 222 p. p.)
- Place of Publication:
- KIT Scientific Publishing 2018
- Language Note:
- English
- Summary:
- To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
- ISBN:
- 1000077963
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.