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Stochastic finite element modeling in electronic packaging / Liu Chu.
- Format:
- Book
- Author/Creator:
- Chu, Liu (Materials scientist), author.
- Language:
- English
- Subjects (All):
- Artificial intelligence--Industrial applications.
- Artificial intelligence.
- Electronic packaging--Data processing.
- Electronic packaging.
- Engineering.
- Materials science.
- Mathematics.
- Probabilities.
- Stochastic processes.
- Technology.
- Electronic books.
- Physical Description:
- 1 online resource (xiii, 274 pages) : color illustrations
- Place of Publication:
- Hoboken, New Jersey : John Wiley & Sons, Inc., [2026]
- Contents:
- Chapter 1. Overview
- Chapter 2. Electronic packaging
- Chapter 3. Random Sampling Methods
- Chapter 4. Random Fields and Stochastic Processes
- Chapter 5. Reliability Prediction
- Chapter 6. Finite element method
- Chapter 7. Nonlinear Stochastic finite element method
- Chapter 8. Random shear stress and thermal temperature
- Chapter 9. Material uncertainty in electro-migration
- Chapter 10. Mechanical reliability in the replaceable integrated chiplet assembly
- Chapter 11. Kriging Surrogate Model
- Chapter 12. Digital twins based on SFEM.
- Notes:
- Includes bibliographical references and index.
- Electronic reproduction. Hoboken, N.J. Available via World Wide Web.
- Description based on online resource; title from digital title page (viewed on February 19, 2026).
- Other Format:
- Print version :
- ISBN:
- 9781394352951
- 1394352956
- 9781394352975
- 1394352972
- 9781394352968
- 1394352964
- Publisher Number:
- 90104286438
- CIPO000336895
- Access Restriction:
- Restricted for use by site license.
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