An Electronic High Density Packaging Concept Suitable for Under the Hood Automotive Applications

Format:

Conference/Event

Author/Creator:

Casson, Keith, author.

Conference Name:

International Congress & Exposition (1992-02-24 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1992

Summary:

There is an explosion taking place in automotive electronics applications. From an estimated electronics content in 1988 of an average $400 value per vehicle, most experts forecast a growth to over $2,000/ vehicle by the year 2000.Virtually all functions in future vehicles will be controlled electronically. Electronic control units (ECUs) will be utilized to monitor and control engine and transmission functions, ignition, anti-lock braking and positive traction, active suspension, power steering, active navigation, air bag actuation, collision avoidance, entertainment, comfort control systems and many other automotive functions.This article outlines a novel electronics packaging concept that brings unparalleled reliability to surface mounted component electronic assemblies and allows these ECUs to be mounted under the hood of vehicles or in other advantageous locations on or very near the devices and functions the ECUs are controlling

Notes:

Vendor supplied data

Publisher Number:

920156

Access Restriction:

Restricted for use by site license