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Columbus Water Pump Package Overview Microtecnica S.p.A. Torino, Italy

SAE Technical Papers (1906-current) Available online

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Format:
Conference/Event
Author/Creator:
Orlando, R., author.
Conference Name:
International Conference On Environmental Systems (1991-07-08 : San Francisco, California, United States)
Language:
English
Physical Description:
1 online resource
Place of Publication:
Warrendale, PA SAE International 1991
Summary:
This paper provides a comprehensive description of the present status of the Water Pump Subassembly (WPSA) that will be part of the Active Thermal Control System of the Pressurized Modules of Columbus, the Attached Laboratory (PM4) and the PM2 of the Man Tended Free Flyer.Description of major components of the Subassembly are presented along with the results of trade-offs performed and rationals for concept selection
Notes:
Vendor supplied data
Publisher Number:
911450
Access Restriction:
Restricted for use by site license

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