High Conductance Thermal Interface Concept for Space Applications

Format:

Conference/Event

Author/Creator:

Poulin, Elizabeth C., author.

Conference Name:

International Conference On Environmental Systems (1991-07-08 : San Francisco, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1991

Summary:

AbstractAn interface concept has been developed which produces high conductance at a thermal/mechanical joint without resorting to high clamping forces or potentially contaminating fillers such as thermal grease. This paper discusses the characteristics of several variations of the high conductance interface concept and compares them to those of existing interface concepts proposed for several Space Station applications. The application of the high conductance concept to thermal joints such as internal coldplate interfaces and external equipment module to heat acquisition plate interfaces would reduce the weight and complexity and increase the efficiency of the Space Station Thermal Management System

Notes:

Vendor supplied data

Publisher Number:

911340

Access Restriction:

Restricted for use by site license