High Temperature Creep Behavior of Ceramic and Metal Substrates Corning Incorporated Corning, NY

Format:

Conference/Event

Author/Creator:

Gulati, Suresh T., author.

Conference Name:

International Congress & Exposition (1991-02-25 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1991

Summary:

The high temperature creep data for radial specimens, cut from metal and ceramic substrates and subjected to compressive loads representative of mounting and thermal pressure are presented as function of load and temperature. These data show that the creep resistance of metallic specimens under sustained loading varies with temperature and is orders of magnitude lower than that of ceramic specimens. The observed creep deformation in metallic specimens reduces their open frontal area and hydraulic diameter with potentially adverse impact on pressure drop across the metallic substrate

Notes:

Vendor supplied data

Publisher Number:

910374

Access Restriction:

Restricted for use by site license