Adhesion and Surface Chemistry of Sheet Molding Compound American Cyanamid Company Stamford, CT

Format:

Conference/Event

Author/Creator:

Farinato, R.S., author.

Conference Name:

International Congress & Exposition (1991-02-25 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1991

Summary:

The surface chemistry of styrene-crosslinked polyester sheet molding compound (SMC) and its interface with epoxy adhesives was investigated. A readily extractable thermoplastic material in the SMC contributed to the formation of weak boundary layers which could lead to near-interface failures and allow the growth of bubbles in the curing adhesive near the interface. The distribution of components in near-interface failure specimens was determined using FTIR and ESCA. A mathematical model of pore penetration by a curing liquid was developed to investigate dynamic wetting phenomena

Notes:

Vendor supplied data

Publisher Number:

910505

Access Restriction:

Restricted for use by site license