Turnkey Processes for Window Encapsulation Cannon/Tecnos S.p.A

Format:

Conference/Event

Author/Creator:

Zarantonello, Alberto, author.

Conference Name:

International Congress & Exposition (1990-02-26 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1990

Summary:

As window encapsulation technology advances, the requirement for process improvements to decrease cycle time, improve part quantity, and to minimize labor requirements becomes very important to the manufacturers. Traditional module systems have advanced to include closed-loop control metering units; fast acting, reliable presses; and SPC data collection systems.Turnkey automatic systems include robotic load/unloading, centering station, automatic/semi-automatic priming station, and robotic IMC/mold release.The demands to reduce overall costs has led manufacturers to consider several alternatives that prove best for their application. This paper is to list and expand on these alternative solutions

Notes:

Vendor supplied data

Publisher Number:

900520

Access Restriction:

Restricted for use by site license