Cost Parity of Electronic, Electromechanical and Mechanical Instrument Clusters Nippondenso Company Limited

Format:

Conference/Event

Author/Creator:

Masuda, Hiroyuki, author.

Conference Name:

Convergence International Congress & Exposition On Transportation Electronics (1990-10-15 : Dearborn, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1990

Summary:

This article is concerned with the issue of whether the cost of electronic, electromechanical and mechanical instrument clusters adequately correspond with performance and functional capabilities; and if not, whether means exist to compensate for this disparity.Considering recent user needs and changes in consumer attitudes toward value assessment, we have concluded that the cost parity of various types of instrument clusters can be realized by appropriately integrating special advantages into the clusters to fabricate added value products with strong market appeal

Notes:

Vendor supplied data

Publisher Number:

901165

Access Restriction:

Restricted for use by site license