EEC-IV Module Thermal Analysis Program

Format:

Conference/Event

Author/Creator:

Torossian, Patrick, author.

Conference Name:

Passenger Car Conference & Exposition (1990-09-17 : Dearborn, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1990

Summary:

AbstractModule Thermal Analysis (MTA) is a program to evaluate and compare the thermal characteristics of various transistor and IC package positions in the Electronic Engine Control (EEC-IV) module. The design engineer can select transistor and IC wattages and their locations on the new EEC-IV housing. After the design engineer has chosen and located the devices on the MTA module housing, the program creates an input file which is submitted to a finite element analysis program called ANSYS. This is done through DIGITAL's ALL-IN-1 menu-driven interface which also includes a custom library of devices and wattage combinations to choose from. ANSYS uses the wattage information to determine IC die temperatures of all the devices and generates a color plot showing the temperature isotherms throughout the module. The die temperature output analysis is returned to ALL-IN-1 and stored with the corresponding module layout, which correlates the housing die temperature to each device

Notes:

Vendor supplied data

Publisher Number:

901719

Access Restriction:

Restricted for use by site license