Use of Computerized Mold Filling Analysis in Predicting the Quality of Molded Plastic Instrument Panel Attachment Bosses

Format:

Conference/Event

Author/Creator:

McKittrick, Gary P., author.

Conference Name:

International Congress & Exposition (1990-02-26 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1990

Summary:

In order to more fully explain variations in the performance of instrument panel (IP) structural attachment bosses of molded plastic, computerized mold filling analysis was performed on a mold cavity and its melt distribution system (manifold, drops, runners and gates). A comparison of the simulated filling pattern with measured boss stripping torques showed a correlation between boss quality and the conditions experienced by the melt during the molding process.By optimizing the diameters of various flow channels in the mold, an improvement in the quality of certain "problem" bosses is anticipated. Balancing of the filling pattern to improve boss performance is also expected to enhance the processability of the mold.Recommendations which resulted from this study are currently being implemented to quantify benefits and substantiate conclusions. If successful, design engineers will have another tool to provide confidence in using structural attachment bosses on molded plastic instrument panels

Notes:

Vendor supplied data

Publisher Number:

900728

Access Restriction:

Restricted for use by site license