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Critical Parameters for Surface Mounting Components Taiyo Yuden (USA) Incorporated
- Format:
- Conference/Event
- Author/Creator:
- Hess, Brian R., author.
- Conference Name:
- SAE Future Transportation Technology Conference and Exposition (1987-08-10 : Seattle, Washington, United States)
- Language:
- English
- Physical Description:
- 1 online resource
- Place of Publication:
- Warrendale, PA SAE International 1987
- Summary:
- The new technology of surface mounting provides opportunities and introduces more "Engineering Variables". These "Variables" can be identified as the most critical concerns for successful surface mounting of transistors, integrated circuits, resistors, capacitors, etc. In short, the entire component complement used for a particular circuit design. These "Key" or critical parameters follow the design from the circuit concept by an engineer, through the process of fabrication; to the point of shipment. We will make several stops along this process journey and point out these critical areas
- Notes:
- Vendor supplied data
- Publisher Number:
- 871564
- Access Restriction:
- Restricted for use by site license
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