Tape Automated Bonding Intel Corporation

Format:

Conference/Event

Author/Creator:

Howard, Randy, author.

Conference Name:

SAE Future Transportation Technology Conference and Exposition (1987-08-10 : Seattle, Washington, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1987

Summary:

Intel's Package Development Group began development of Tape Automated Bonding (TAB) (See Figure 1) for two primary purposes: as a lead frame to device interconnect for high lead count products; and, as a stand-alone for surface-mounted-devices (SMD). New production assembly equipment, bumping equipment and tape technology have made it possible for TAB to become production-worthy.Intel, over the past few years, has made progress in the development of TAB technology. Using a 16-bit micro-controller as the process characterization vehicle, numerous milestones have been accomplished: tape design, carrier design, and assembly development. The 16-bit micro-controller has been tested to an Automotive product type flow and a number of piece part specifications have been generated. In addition, much of the production equipment has been characterized, and process characterization is well under way

Notes:

Vendor supplied data

Publisher Number:

871568

Access Restriction:

Restricted for use by site license