Electronic Packaging Needs Met by Three Dimensional Molded Interconnection Packages Circuit-Wise, Incorporated and Mint-Pack Tech., Incorporated

Format:

Conference/Event

Author/Creator:

Mettler, Jack, author.

Conference Name:

SAE Future Transportation Technology Conference and Exposition (1987-08-10 : Seattle, Washington, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1987

Summary:

Recent developments in plating and imaging of circuit patterns on three dimensional shapes have made it possible to apply electronic circuitry directly to the surface of a molded plastic part of complex configuration. Thus both mechanical and electrical functionality can be combined in a single low cost component. The paper reviews the state of the art of this Molded Interconnection Packaging Technology, describing advantages and limitations and offering examples of specific designs

Notes:

Vendor supplied data

Publisher Number:

871569

Access Restriction:

Restricted for use by site license