Mold Filling Analysis of Instrument Panels P.E.T.S

Format:

Conference/Event

Author/Creator:

Tooman, Patrick A., author.

Conference Name:

SAE International Congress & Exposition (1988-02-29 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1988

Summary:

Moldfilling analysis technology is used throughout the plastics industry to improve the processability of injection molding tooling. Nowhere is the use of this technique more critical than in the design of tooling for automotive instrument panel substrates. The analysis of these large, complex tools has resulted in improved processing, as well as improved finished part performance and quality

Notes:

Vendor supplied data

Publisher Number:

880032

Access Restriction:

Restricted for use by site license