1 option
Surface Quality Optimization of Adhesive Bonded SMC Assemblies Through Designed Experimentation and Photographic Analysis Premix/E.M.S. Incorporated
- Format:
- Conference/Event
- Author/Creator:
- Martin, David L., author.
- Conference Name:
- SAE International Congress & Exposition (1988-02-29 : Detroit, Michigan, United States)
- Language:
- English
- Physical Description:
- 1 online resource
- Place of Publication:
- Warrendale, PA SAE International 1988
- Summary:
- This paper will discuss an approach to surface quality optimization for adhesive bonded SMC assemblies. The use of designed experimentation methodology based on orthogonal arrays will be described as applied to assembly process parameters. Evaluation of results with a photographic process will be used to generate data for analysis. The analysis of this data will conclude this approach to surface quality optimization
- Notes:
- Vendor supplied data
- Publisher Number:
- 880533
- Access Restriction:
- Restricted for use by site license
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.