Automotive Module Burn-In-A Means to Reliability Verification Bendix Electronics Allied Automotive

Format:

Conference/Event

Author/Creator:

Kent, L. Lee, author.

Conference Name:

SAE International Congress & Exposition (1987-02-23 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1987

Summary:

The objective of this paper is to demonstrate that a high temperature, operational burn-in of an automotive electronic module can be an effective means of verifying the module reliability prediction and of anticipating its actual field failure experience. This will be accomplished by reviewing the operation and methods used in an actual production system and will include analysis of the burn-in results and the results of the field performance of the product question

Notes:

Vendor supplied data

Publisher Number:

870056

Access Restriction:

Restricted for use by site license