Instrument Panel Performance- An Applications Approach-Part 2 Monsanto Chemical Company Springfield, MA

Format:

Conference/Event

Author/Creator:

Hall, William J., author.

Conference Name:

SAE International Congress & Exposition (1987-02-23 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1987

Summary:

A paper was presented at the 1986 SAE congress which accounted in part, for the variability in physical property performance within injection molded instrument panel carriers. As a continuation of that paper we developed two test molds to allow us to make a more fundamental examination of weld lines. One of these is a 76.2 101.6 mm flat test chip which is double gated to form a well defined weld line. This has enabled us to measure physical properties (including impact strength) of the weld line as a function of materials and molding conditions. Apparent color variations across the the weld line as a function of polymer morphology was studied as was paintability. The second mold, a boss testing tool, has allowed us to study the weld lines which form on the downstream side of these functionally important fastening points

Notes:

Vendor supplied data

Publisher Number:

870203

Access Restriction:

Restricted for use by site license