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Chip-in-Glass FIP's (Fluorescent Indicator Panel) for Automotive Applications NEC Corporation
- Format:
- Conference/Event
- Author/Creator:
- Yoshida, Yukitoshi, author.
- Conference Name:
- SAE International Congress & Exposition (1987-02-23 : Detroit, Michigan, United States)
- Language:
- English
- Physical Description:
- 1 online resource
- Place of Publication:
- Warrendale, PA SAE International 1987
- Summary:
- This paper describes the latest Fluorescent Indicator Panel (FIP) technology, featuring integrated circuits mounted within the vacuum envelope on the glass substrate. This is called Chip-in-Glass FIP, or CIG FIP. The discussion includes basic technologies, design flexibility, reliability, and driver ICs
- Notes:
- Vendor supplied data
- Publisher Number:
- 870209
- Access Restriction:
- Restricted for use by site license
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