My Account Log in

1 option

Integrated Hybrid Pressure Sensor Using a Piezoresistive Thickfilm Sensor Element Robert Bosch GmbH Stuttgart

SAE Technical Papers (1906-current) Available online

View online
Format:
Conference/Event
Author/Creator:
Glas, Hans Joachim, author.
Conference Name:
SAE International Congress & Exposition (1987-02-23 : Detroit, Michigan, United States)
Language:
English
Physical Description:
1 online resource
Place of Publication:
Warrendale, PA SAE International 1987
Summary:
High-performance electronic systems for automotive engine control largely depend on the existence of qualified sensors. Together with actuators they determine the efficiency, reliability and also the costs of the entire system.In addition to the engine speed, the air flow through the intake manifold and the throttle-valve position, the absolute manifold pressure is an important input parameter for engine-control systems. Appropriate pressure transducers have to be made available for several pressure ranges, e. g. 100 kPa and 200 kPa, and packaged in suitable housings, especially as an on-board component for insertion into electronic control units.On the basis of thick-film technology - well established in the production of automotive microcircuits /1/* - we present a new generation of integrated hybrid pressure sensors.A novel thick-film process was developed, to build up self-supporting micromechanical structures of dielectric materials onto a ceramic substrate. A miniature diaphragm of about 5 mm diameter and 0.1 mm thickness can be produced by applying several screen printing and firing sequences. Together with the substrate it forms a hermetically tight, bubble-like cavity of 60 m in height. Piezo-resistive thick-film resistors are printed on the center of the diaphragm. With a gauge factor of 15 they transform the mechanical tension, caused by changes of the ambient pressure, into an electrical signal. Both the sensor element and an electronic signal-conditioning circuit are integrated on one ceramic substrate without additional bonding. The housing, in which the hybrid circuit is mounted, consists of two parts. It is made from glass-reinforced thermoplastic material with excellent mechanical strength. The entire sensor has a weight of only 15 g.Technology, construction details and performance of the new device are presented in this paper
Notes:
Vendor supplied data
Publisher Number:
870286
Access Restriction:
Restricted for use by site license

The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.

My Account

Shelf Request an item Bookmarks Fines and fees Settings

Guides

Using the Library Catalog Using Articles+ Library Account