Severe Environment Packaging for Integrated Sensors North American R&D Center Bendix Electronics

Format:

Conference/Event

Author/Creator:

Teat, William H., author.

Conference Name:

SAE International Congress & Exposition (1987-02-23 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1987

Summary:

Enhanced packaging techniques are necessary for the realization of durable integrated sensors intended for severe automotive environments. Silicon micromachined sensing elements and semiconductor devices are used to construct integrated sensors. These components require innovative packaging in order to function reliably under the harsh conditions encountered at engine and chassis mounting locations.As integrated sensors, like their more passive transducer predecessors, will be key determinants of emission controls, mileage performance and safety and comfort systems, their reliability is of paramount concern. Packaging and interconnect techniques used for integrated sensors must insure that the inherent reliability of semiconductor devices, used in sensor construction, is not degraded.This paper details the packaging strategies available for integrated sensors. Design trade-offs are discussed in light of required environments for several types of devices. Emphasis is placed on techniques applicable to silicon-based sensors and integrated signal-conditioning circuitry

Notes:

Vendor supplied data

Publisher Number:

870294

Access Restriction:

Restricted for use by site license