Computer Modelling of Phenolic Postcure Rogers Corporation Rogers, CT

Format:

Conference/Event

Author/Creator:

Arimond, John, author.

Conference Name:

SAE International Congress & Exposition (1987-02-23 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1987

Summary:

Parts made from phenolic molding materials must be postcured to promote the thorough crosslinking required for end usage at temperatures above about 175°C. Since the time and energy used in postcuring can represent about ten percent of part cost, efficient postcuring offers significant potential savings.Based on a kinetic description of the phenolic crosslinking reaction, we have developed a computer model to predict the development of the glass transition during postcure. This model provides a convenient CAD tool for minimizing postcuring costs

Notes:

Vendor supplied data

Publisher Number:

870536

Access Restriction:

Restricted for use by site license