Heat Pipe Cooled Electronic Circuit Card as Applied to SEM FORMAT B Standard Grumman Corporation, Bethpage, NY

Format:

Conference/Event

Author/Creator:

Cirrito, Vincent, author.

Conference Name:

Intersociety Conference on Environmental Systems (1985-07-15 : San Francisco, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1985

Summary:

Grumman developed, patented, and tested a heat pipe concept to increase the power dissipation capability of the SEM FORMAT B Standard Module. The systems integration concept approach in the development of the design was to:Within the restraints of these objectives, the Grumman concept was shown to be feasible and proven to be capable of providing a power dissipation capability twice that of the existing conduction module

Notes:

Vendor supplied data

Publisher Number:

851317

Access Restriction:

Restricted for use by site license