IC Chip on PWB Development for an Automobile Clock Ford Motor Company

Format:

Conference/Event

Author/Creator:

Waineo, Keith, author.

Conference Name:

SAE International Congress & Exposition (1985-02-25 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1985

Summary:

In recent years, considerable effort has been directed to reducing the size while increasing the feature content of electronic products in an automobile. One method of achieving this task is to mount integrated circuits in die form directly to a printed circuit board. This method is known as "IC Chip On Board". The elimination of an IC package results in a significant size reduction of electronic modules

Notes:

Vendor supplied data

Publisher Number:

850138

Access Restriction:

Restricted for use by site license