Hybrid Circuit Assembly and Surface Mount Technology Pacific Hybrid Microelectronics, Incorporated

Format:

Conference/Event

Author/Creator:

Danner, Paul, author.

Conference Name:

West Coast International Meeting and Exposition (1985-08-04 : Portland, Oregon, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1985

Summary:

Surface mount technology is the method of attaching leadless, short leaded or bare chips to various substrate materials. This technology is not new, but has caught on as a method of assembling printed circuit boards and is considered the wave of the future. This may be regarded as a marriage between conventional hybrid assembly and printed circuit boards as this technology has been recognized for over 30 years in the hybrid industry.This paper will discuss the assembly methods and the merits of both of these technologies

Notes:

Vendor supplied data

Publisher Number:

851460

Access Restriction:

Restricted for use by site license