A Thermal Model for Audio Power Amplifiers

Format:

Conference/Event

Author/Creator:

Southworth, Thomas R., author.

Conference Name:

SAE International Congress & Exposition (1984-02-27 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1984

Summary:

This paper develops a thermal model for analyzing transient and steady state heat flow in power amplifier heat sinks. This model is used to predict I.C. junction and heat sink temperatures, power output, and power dissipation over any time interval. Methods of determining heat sink parameters are discussed followed by a comparison of measured versus calculated data on a two channel power amplifier

Notes:

Vendor supplied data

Publisher Number:

840163

Access Restriction:

Restricted for use by site license