Worldwide Status of Leadless Component Assembly Technology

Format:

Conference/Event

Author/Creator:

Moe, Richard M., author.

Conference Name:

International Congress on Transportation Electronics (1982-10-04 : Dearborn, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1982

Summary:

The wide variety of available leadless electronic components is described. Some typical applications of these devices are illustrated. The advantages to be gained through the use of these surface mounted devices are explained. These include reduced size, increased reliability, improved performance and reduced cost. Methods of application, including automatic assembly equipment, are discussed. Several applicable soldering processes are explained

Notes:

Vendor supplied data

Publisher Number:

820916

Access Restriction:

Restricted for use by site license