Proposed Reliability Prediction Method for Electronic Modules in Automotive Applications Bendix, Troy, New York

Format:

Conference/Event

Author/Creator:

Binroth, W., author.

Conference Name:

SAE International Congress & Exposition (1983-02-28 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1983

Summary:

This paper discusses two models for predicting reliability for electronic modules in automotive applications. Both of these models were developed on data submitted by members of the Electronics Reliability Subcommittee of the SAE. The data base includes no military data (automotive data only) and in that sense the two models are new in the industry.The authors also present guidelines for use of both of the models as well as comments on results achieved by several subcommittee members when comparing the effectiveness of the models to available life data for several example modules. The format of the two models is similar to those used in MIL-HDBK-217, although these models lack in detail due to data base limitations

Notes:

Vendor supplied data

Publisher Number:

830409

Access Restriction:

Restricted for use by site license