A Compact High Intensity Cooler (CHIC) Sundstrand Advanced Technology Group Division of Sundstrand Corporation Rockford, IL

Format:

Conference/Event

Author/Creator:

Bland, T. J., author.

Conference Name:

Intersociety Conference on Environmental Systems (1983-07-11 : San Francisco, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1983

Summary:

A unique heat exchanger has been developed with potential applications for cooling high power density electronics and perhaps high energy laser mirrors. The device was designed to absorb heat fluxes of approximately 50 w/cm2 (158,000 Btu/hr.ft2) with a low thermal resistance, a high surface temperature uniformity and very low hydraulic pumping power. A stack of thin copper orifice plates and spacers was bonded together and arranged to provide liquid jet impingement heat transfer on successive plates. This configuration resulted in effective heat transfer coefficients, based on the prime surface, of about 85,000 w/m2 °C (15,000 Btu/hoursft2 °F) and 1.8 watts (.002 HP) hydraulic power with liquid Freon 11 as coolant

Notes:

Vendor supplied data

Publisher Number:

831127

Access Restriction:

Restricted for use by site license