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Failure Analysis Pertaining to Automotive Electronic Products Electronic Quality Assurance Dept. Nippondenso Company, Limited Kariya-shi, Aichi-ken, Japan
- Format:
- Conference/Event
- Author/Creator:
- Yamamoto, Shogo, author.
- Conference Name:
- International Pacific Conference on Automotive Engineering (1981-11-16 : Honolulu, Hawaii, United States)
- Language:
- English
- Physical Description:
- 1 online resource
- Place of Publication:
- Warrendale, PA SAE International 1981
- Summary:
- The quality level of automotive electronic products produced in NIPPONDENSO CO., LTD. is such a good level as we evaluate warranty claims by pagesp.m. level and not by percent level.We have carried out exhaustive failure analysis on warranty returns, qualification tests on newly purchased parts, and precise data analysis on warranty claims for many years so that we attain such a good quality level.We offered those data obtained from above results to the sections concerned. It was remarkable successful that we put improvements for failure causes of semiconductor devices in co-operation with manufacturers of semiconductor devices, In this report, I would like to present the improving processes of semiconductor devices' failures which are majority of failures of automotive electronic products by indicating some of the failure modes and analized results obtained by using Weibull probability papers
- Notes:
- Vendor supplied data
- Publisher Number:
- 811420
- Access Restriction:
- Restricted for use by site license
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