Thermal Design of Standard Avionic Enclosures Boeing Aerospace Company

Format:

Conference/Event

Author/Creator:

Franklin, James L., Jr. (James Lee), 1947- author.

Conference Name:

Intersociety Conference on Environmental Systems (1982-07-19 : San Diego, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1982

Summary:

This paper details the development of standardized avionic enclosures for Naval aircraft, with particular emphasis on the package's thermal design. The packaging system is unique in that it can accommodate modules of two different standardized sizes (ISEM-2A and 1/2 ATR), and modules having three different cooling modes -conduction cooled, flow-through cooled, and heat pipe cooled. The three module cooling modes, together with required package dissipation rates of 125 watts/MCU and pressure drops below 2.8 mm mercury create a great deal of complexity in the optimization of the thermal system. A computerized optimization program was therefore utilized to achieve specific designs, with results reported for various module mixes and heat exchanger designs

Notes:

Vendor supplied data

Publisher Number:

820878

Access Restriction:

Restricted for use by site license