Packaging the VSCF System for an Aircraft Engine Environment Westinghouse Electric Corporation, Aerospace Electrical Div., Lima, OH

Format:

Conference/Event

Author/Creator:

Pollard, David D., author.

Conference Name:

Aerospace Congress & Exposition (1981-10-05 : Anaheim, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1981

Summary:

This paper addresses the packaging considerations and techniques used in the design of a fully integrated VSCF package which is mounted on an engine accessory gearbox. Special design considerations such as vibration, altitude, and temperature in the gearbox area are discussed. A comparison and description of various methods of cooling, such as cold plate, immersion, and spray within a self contained cooling/lubrication system is also presented. The paper describes the integration of microprocessor modules, high power semiconductor arrays, and a high-speed generator, to form a compact, low weight VSCF system

Notes:

Vendor supplied data

Publisher Number:

811088

Access Restriction:

Restricted for use by site license