Palladium-and Solder-Plated Connectors for the Automotive Industry E. I. du Pont de Nemours and Company, Incorporated, Berg Electronics

Format:

Conference/Event

Author/Creator:

Conrad, Lee R., author.

Conference Name:

SAE International Congress & Exposition (1982-02-22 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1982

Summary:

The low signal level microprocessors used in automobiles require very good electrical connections. Typically, these connectors are gold-plated. Work has been done to show that gold-plated connectors need not be used in many circumstances. Extensive testing on two specific connector geometries compares palladium- and solder-plated connectors to gold. The results presented in this paper show that palladium and solder (60/40 or 90/10 tin/ lead) perform equivalently to gold on properly designed connectors, This performance is maintained even in very extreme environments such as salt spray, hydrogen sulfide, mechanical, thermal, and vibrational shocks, as well as combinations of these environments

Notes:

Vendor supplied data

Publisher Number:

820070

Access Restriction:

Restricted for use by site license