Micromachined Electromechanical Sensors for Automotive Applications Motorola

Format:

Conference/Event

Author/Creator:

Verma, Rajan, author.

Conference Name:

International Congress & Exposition (1998-02-23 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1998

Summary:

This paper is going to discuss typical requirements for micromachined sensors. The most common examples today are pressure and acceleration sensors. We will discuss the function and applications of pressure and acceleration sensors. There are two differences between accelerometers and pressure sensors: sensor technology and signal conditioning. Pressure sensors employ bulk micromachining techniques where accelerometers use surface micromachining. Pressure sensors are typically signal conditioned with bipolar circuitry. Acceleration sensors use CMOS signal conditioning. We will also explain the electrical characteristics of both pressure and acceleration sensors along with mechanical package styles. We will be focusing our effort on automotive based applications. Some typical applications for pressure sensors in the automotive environment are MAP, BAP, lumbar seat, air bag and tire pressure. The requirements of the MAP/BAP application will also be discussed in detail. Some typical applications for the acceleration sensor are front airbag, side airbag, yaw rate, active suspension and ABS. Parameter requirements for the accelerometer in a typical front airbag system will be presented

Notes:

Vendor supplied data

Publisher Number:

980270

Access Restriction:

Restricted for use by site license