Epoxy Adhesives for Automotive Assembly Operations

Format:

Conference/Event

Author/Creator:

Bolger, Justin C., author.

Conference Name:

1980 Automotive Engineering Congress and Exposition (1980-02-25 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1980

Summary:

This paper describes several new epoxy adhesives and bonding processes specifically developed for high volume, low cost automotive assembly operations. The applications include halogen-quartz headlamps; assembly of a variety of under-the-hood electrical and electronic components; a one component epoxy body solder used since 1971 to replace lead in the exposed body joints of taxicabs and other vehicles; and low temperature curing, flexible epoxy adhesives used to increase the strength of steel body joints of school buses and other "rivet bonded" structures

Notes:

Vendor supplied data

Publisher Number:

800209

Access Restriction:

Restricted for use by site license