Lead Free Solder for Vehicle Electronics

Format:

Conference/Event

Author/Creator:

Whitten, Gordon, author.

Conference Name:

International Truck and Bus Meeting & Exposition (1997-11-17 : Cleveland, Ohio, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1997

Summary:

Several lead-free alloys have been studied for potential use in electronics by the National Center for Manufacturing Sciences(NCMS) Lead Free Solder Consortium that ended in 1996. Since then, one of these alloys has been studied using an existing product in order to determine the viability of Lead Free Vehicle Electronics. Design, supply chain, manufacturability, and reliability data for the electronics components and system are a part of this paper

Notes:

Vendor supplied data

Publisher Number:

973210

Access Restriction:

Restricted for use by site license