Thermal and Acoustical Modeling of Multispan Sandwich Panels with Complex Boundary Conditions ONERA-CERT

Format:

Conference/Event

Author/Creator:

Murer, Yann, author.

Conference Name:

World Aviation Congress & Exposition (1997-10-13 : Anaheim, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1997

Summary:

This paper presents a thermal and acoustical modeling of multilayer sandwich panels which is dedicated to design and optimization steps in aeronautical and spatial industries. The acoustical part of the model describes free and forced vibrations, and radiation of multispan plates; particular attention is paid to the boundary conditions on the edges of the plate (elastic restraints, local clamping, et cetera). The different heat transfer modes occurring in sandwich plates are reduced to develop a conductive equivalent model with convective conditions on the face of the plate. Various experiments allow a first validation of the model

Notes:

Vendor supplied data

Publisher Number:

975533

Access Restriction:

Restricted for use by site license