PBGA Reliability Study for Automotive Applications Ford Visteon Automotive Systems

Format:

Conference/Event

Author/Creator:

Adams, Rickie M., author.

Conference Name:

International Congress & Exposition (1998-02-23 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1998

Summary:

Plastic Ball Grid Array (PBGA) packages have been used in many applications. Most studies designed to verify solder joint reliability and package integrity have focused on commercial applications (Temperature Cycling range 0°C to 100°C). Other studies have shown that this package design will not meet the requirements for automotive applications.1 Design enhancements aimed at making the PBGA more robust and capable of being used in automotive application have been suggested. A joint effort by Chrysler, Delco Electronics, Ford Visteon Automotive Systems, and Motorola Semiconductor was organized to design and test PBGA packages for automotive applications and to develop module assembly processes for PBGA packages

Notes:

Vendor supplied data

Publisher Number:

980341

Access Restriction:

Restricted for use by site license