Adhesiveless Flexible Laminate in Automotive Under-the-Hood Electronics

Format:

Conference/Event

Author/Creator:

Ehlert, John E., author.

Conference Name:

International Congress & Exposition (1998-02-23 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1998

Summary:

Base laminate requirements for flexible circuits in under-the-hood applications are becoming more stringent. This paper examines those requirements as well as supporting test data of an adhesiveless laminate currently used in an under-the-hood application. In addition, a comparison between rigid and flexible laminate based circuits as well as adhesive based and adhesiveless laminates is discussed

Notes:

Vendor supplied data

Publisher Number:

980342

Access Restriction:

Restricted for use by site license