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Correlation of Thermal Cycle Tests to Field Usage Profiles for Solder Joints in Automotive Electronics Visteon Automotive Systems
- Format:
- Conference/Event
- Author/Creator:
- Hu, Jimmy M., author.
- Conference Name:
- International Congress & Exposition (1998-02-23 : Detroit, Michigan, United States)
- Language:
- English
- Physical Description:
- 1 online resource
- Place of Publication:
- Warrendale, PA SAE International 1998
- Summary:
- This paper reviews the physics-of-failure model for accelerated thermal cycle tests of solder joints associated with various electronics components, summarizes the parameters of the automotive environment, and discusses the methods for developing thermal cycle tests for reliability validation for automotive electronics. The paper proposes an approach to develop the requirements for validation tests based on the customer usage profiles and the desired product life goal. This requirement determines the nominal testing duration based on the equivalent damage generated from the worst-case field applications
- Notes:
- Vendor supplied data
- Publisher Number:
- 980344
- Access Restriction:
- Restricted for use by site license
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