Integration of Simulation and Testing for Microelectronics Package Reliability Improvement Semiconductor Products Sector (SPS), Motorola Incorporated

Format:

Conference/Event

Author/Creator:

Li, Quan, author.

Conference Name:

International Congress & Exposition (1998-02-23 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1998

Summary:

Computer simulation has been used as a vital and powerful tool for evaluating stresses in microelectronics packages due to thermal-mechanical loading. Experimental measurement and reliability testing have been performed for modeling correlation and verification. In the past several years, the authors have been integrating computer simulation and testing to significantly improve package reliability at Motorola SPS. Several examples are presented for illustration and demonstration of the methodology

Notes:

Vendor supplied data

Publisher Number:

980345

Access Restriction:

Restricted for use by site license