Transient Thermal Analysis of Power Electronics Visteon Automotive Systems

Format:

Conference/Event

Author/Creator:

Luettgen, Mike, author.

Conference Name:

International Congress & Exposition (1998-02-23 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1998

Summary:

This paper describes a method for calculating the temperature of a semi-infinite heat sink plate of a given thickness, subjected to transient heating by a D2Pak power IC. Accurate prediction of the heat sink temperature over time then allows for more accurate calculation of the IC junction temperature. A set of curves have been developed for the time variation of heat sink plate temperature. This has been achieved by the use of finite element methods, and modeling a large range of configurations. The system variables were put into dimensionless form, and the model results plotted. The resulting plot indicates an effective thermal resistance of a given heat sink plate at a given point in time. A curve fit has also performed on the results. The results of the finite element model have been compared with laboratory data

Notes:

Vendor supplied data

Publisher Number:

980346

Access Restriction:

Restricted for use by site license