Next Generation Hemflange Adhesive Uniseal, Incorporated

Format:

Conference/Event

Author/Creator:

Ferguson, Tim, author.

Conference Name:

International Congress & Exposition (1998-02-23 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1998

Summary:

As component sheet metals become thinner and surface properties prove to be more dynamic than ever, conventional induction heat catalyzed adhesives must evolve to perform under increasingly restrictive parameters. Thin metal distortion at typical induction cure temperatures, coupled with shelf life restrictions that seem to be inherent with most commercially available one component adhesive systems, has forced the need for a "Next Generation" hem adhesive. This presentation focuses on the recent development of a one component induction heat responsive structural adhesive which meets the critical requirements of the automobile manufacturing arena of the future. This adhesive system shows impressive results in low-temperature induction cure scenarios and has been capable of maintaining exceptional adhesion characteristics on numerous substrates

Notes:

Vendor supplied data

Publisher Number:

980462

Access Restriction:

Restricted for use by site license